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            This Model is Delayed: ETA January 15, 2026Type: RackmountProcessor: Intel® Xeon® Scalable Processors 5th/4th Gen LGA-4677 (Socket E), CPU TDP supports up to 350W TDPChipset: Intel C741 Chipset
 Dimensions of Enclosure: 17"D x 17"W x 3.46"HStarting Hard Drive: 1TB PCIe 5.0 NVMe SSD M.2 7,150/6,300MB/s - Samsung 990 EVO PlusStarting Memory: 2x 16GB DDR5 5600MHz ECC Registered RAMMax Memory: Up to 2048GBRAID: 0,1,5,10 and NVMe 0,1 RAID Intel VROC
 Ports: 2 x LAN, 1 x COMUSB: 4 x USB 2.0 Ports, 3 x USB 3.2 Gen 1 PortsLow Profile Slots: 4 x PCIe x16, 1 x PCIe x8CD/DVD Optional
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                            Type: RackmountProcessor: Intel® Core™ X-series Processors ( FCLGA2066)Chipset: Intel X299 Chipset
 Dimensions of Enclosure: 17.72"D x 17.24"W x 3.46"HStarting Hard Drive: 500GB M.2 2280 NVMe SSD or greater 5,000/3,000MB/sStarting Memory: 4x 8GB DDR4 3200MHz RAMMax Memory: Up to 128GBRAID: 0,1,5,10
 Ports: 2 x LAN, 1 x COMUSB: 6 x USB 3.2 Gen 1 Ports, 2 x USB 3.2 Gen 2 PortsLow Profile Slots: 7 x PCIe x16CD/DVD Optional
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            This Model is Delayed: ETA January 15, 2026Type: RackmountProcessor: Intel® Xeon® Scalable Processors 5th/4th Gen LGA-4677 (Socket E), CPU TDP supports up to 350W TDPChipset: Intel C741 Chipset
 Dimensions of Enclosure: 19.89"D x 17"W x 6.96"HStarting Hard Drive: 1TB PCIe 5.0 NVMe SSD M.2 7,150/6,300MB/s - Samsung 990 EVO PlusStarting Memory: 2x 16GB DDR5 5600MHz ECC Registered RAMMax Memory: Up to 2048GBRAID: 0,1,5,10 and NVMe 0,1 RAID Intel VROC
 Ports: 2 x LAN, 1 x COMUSB: 4 x USB 2.0 Ports, 3 x USB 3.2 Gen 1 PortsFull Height Slots: 4 x PCIe x16, 1 x PCIe x8CD/DVD Optional
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            This Model is Delayed: ETA January 15, 2026Type: RackmountProcessor: Intel® Xeon® Scalable Processors 5th/4th Gen LGA-4677 (Socket E), CPU TDP supports up to 350W TDPChipset: Intel C741 Chipset
 Dimensions of Enclosure: 17.72"D x 17.24"W x 3.46"HStarting Hard Drive: 1TB PCIe 5.0 NVMe SSD M.2 7,150/6,300MB/s - Samsung 990 EVO PlusStarting Memory: 2x 16GB DDR5 5600MHz ECC Registered RAMMax Memory: Up to 2048GBRAID: 0,1,5,10 and NVMe 0,1 RAID Intel VROC
 Ports: 2 x LAN, 1 x COMUSB: 4 x USB 2.0 Ports, 3 x USB 3.2 Gen 1 PortsLow Profile Slots: 4 x PCIe x16, 1 x PCIe x8CD/DVD Optional
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            This Model is Delayed: ETA January 15, 2026Type: RackmountProcessor: Intel® Xeon® Scalable Processors 5th/4th Gen LGA-4677 (Socket E), CPU TDP supports up to 350W TDPChipset: Intel C741 Chipset
 Dimensions of Enclosure: 18.43"D x 16.93"W x 6.93"HStarting Hard Drive: 1TB PCIe 5.0 NVMe SSD M.2 7,150/6,300MB/s - Samsung 990 EVO PlusStarting Memory: 2x 16GB DDR5 5600MHz ECC Registered RAMMax Memory: Up to 2048GBRAID: 0,1,5,10 and NVMe 0,1 RAID Intel VROC
 Ports: 2 x LAN, 1 x COMUSB: 4 x USB 2.0 Ports, 3 x USB 3.2 Gen 1 PortsFull Height Slots: 4 x PCIe x16, 1 x PCIe x8CD/DVD Optional
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            This Model is Delayed: ETA January 15, 2026Type: RackmountProcessor: Intel® Xeon® Scalable Processors 5th/4th Gen LGA-4677 (Socket E), CPU TDP supports up to 350W TDPChipset: Intel C741 Chipset
 Dimensions of Enclosure: 16.89"D x 17"W x 6.96"HStarting Hard Drive: 1TB PCIe 5.0 NVMe SSD M.2 7,150/6,300MB/s - Samsung 990 EVO PlusStarting Memory: 2x 16GB DDR5 5600MHz ECC Registered RAMMax Memory: Up to 2048GBRAID: 0,1,5,10 and NVMe 0,1 RAID Intel VROC
 Ports: 2 x LAN, 1 x COMUSB: 4 x USB 2.0 Ports, 3 x USB 3.2 Gen 1 PortsFull Height Slots: 4 x PCIe x16, 1 x PCIe x8CD/DVD Optional
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            This Model is Delayed: ETA January 15, 2026Type: RackmountProcessor: Intel® Xeon® Scalable Processors 5th/4th Gen LGA-4677 (Socket E), CPU TDP supports up to 350W TDPChipset: Intel C741 Chipset
 Dimensions of Enclosure: 16.89"D x 17"W x 6.96"HStarting Hard Drive: 1TB PCIe 5.0 NVMe SSD M.2 7,150/6,300MB/s - Samsung 990 EVO PlusStarting Memory: 2x 16GB DDR5 5600MHz ECC Registered RAMMax Memory: Up to 2048GBRAID: 0,1,5,10 and NVMe 0,1 RAID Intel VROC
 Ports: 2 x LAN, 1 x COMUSB: 4 x USB 2.0 Ports, 3 x USB 3.2 Gen 1 PortsFull Height Slots: 4 x PCIe x16, 1 x PCIe x8CD/DVD Optional
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            This Model is Delayed: ETA January 15, 2026Type: RackmountProcessor: Intel® Xeon® Scalable Processors 5th/4th Gen LGA-4677 (Socket E), CPU TDP supports up to 350W TDPChipset: Intel C741 Chipset
 Dimensions of Enclosure: 17"D x 17"W x 5.22"HStarting Hard Drive: 1TB PCIe 5.0 NVMe SSD M.2 7,150/6,300MB/s - Samsung 990 EVO PlusStarting Memory: 2x 16GB DDR5 5600MHz ECC Registered RAMMax Memory: Up to 2048GBRAID: 0,1,5,10 and NVMe 0,1 RAID Intel VROC
 Ports: 2 x LAN, 1 x COMUSB: 4 x USB 2.0 Ports, 3 x USB 3.2 Gen 1 PortsFull Height Slots: 4 x PCIe x16, 1 x PCIe x8CD/DVD Optional
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                            Type: RackmountProcessor: Intel® Socket LGA4677 for Xeon® W-3400 SeriesChipset: Intel W790 ChipsetMachine Learning HPCAI
 Dimensions of Enclosure: 17.72"D x 17.24"W x 3.46"HStarting Hard Drive: 1TB PCIe 4.0 NVMe SSD M.2 7,450/6,900MB/s - Samsung 990 PROStarting Memory: 4x 16GB DDR5 4800MHz ECC Registered RAMMax Memory: Up to 1500GBRAID: 0,1,5,10 and NVMe 0,1
 Ports: 2 x LAN, 1 x COMUSB: 2 x USB 2.0 Ports, 2 x USB 3.2 Gen 1 Ports, 4 x USB 3.2 Gen 2 PortsLow Profile Slots: 3 x PCIe x16, 1 x PCIe x4CD/DVD Optional
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            This Model is Delayed: ETA January 15, 2026Type: RackmountProcessor: Intel® Xeon® Scalable Processors 5th/4th Gen LGA-4677 (Socket E), CPU TDP supports up to 350W TDPChipset: Intel C741 Chipset
 Dimensions of Enclosure: 20.87"D x 17.30"W x 8.66"HStarting Hard Drive: 1TB PCIe 5.0 NVMe SSD M.2 7,150/6,300MB/s - Samsung 990 EVO PlusStarting Memory: 2x 16GB DDR5 5600MHz ECC Registered RAMMax Memory: Up to 2048GBRAID: 0,1,5,10 and NVMe 0,1 RAID Intel VROC
 Ports: 2 x LAN, 1 x COMUSB: 4 x USB 2.0 Ports, 3 x USB 3.2 Gen 1 PortsFull Height Slots: 4 x PCIe x16, 1 x PCIe x8CD/DVD Optional
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