Long Production through Q4 2024
Type: RackmountProcessor: Xeon E3-1200v5/v6 (LGA1151, ‘Skylake, Kaby Lake’)Chipset: Intel C236 ChipsetDimensions of Enclosure: 18"D x 16.90"W x 3.50"HStarting Hard Drive: 250GB NVMe SSD M.2 2.9GB/1.3GB - Samsung 980Starting Memory: 8GB DDR4 2666MHz RAMMax Memory: Up to 64GBRAID: 0,1 via LSI MegaRAIDPorts: 2 x LAN , 2 x COM USB: 8 x USB 2.0 Ports , 6 x USB 3.2 Gen 1 Ports , 2 x USB 3.2 Gen 2 Ports Full Height Slots: Multiple configurations availableCD/DVD Optional
Long Production through Q4 2024
Type: RackmountProcessor: Xeon E3-1200v5/v6 (LGA1151, ‘Skylake, Kaby Lake’)Chipset: Intel C236 ChipsetDimensions of Enclosure: 17"D x 19"W x 3.50"HStarting Hard Drive: 250GB NVMe SSD M.2 2.9GB/1.3GB - Samsung 980Starting Memory: 8GB DDR4 2666MHz RAMMax Memory: Up to 64GBRAID: 0,1 via LSI MegaRAIDPorts: 2 x LAN , 2 x COM USB: 8 x USB 2.0 Ports , 6 x USB 3.2 Gen 1 Ports , 2 x USB 3.2 Gen 2 Ports Full Height Slots: Multiple configurations availableCD/DVD Optional
Long Production through Q4 2024
Type: RackmountProcessor: Xeon E3-1200v5/v6 (LGA1151, ‘Skylake, Kaby Lake’)Chipset: Intel C236 ChipsetDimensions of Enclosure: 17"D x 19"W x 3.50"HStarting Hard Drive: 250GB NVMe SSD M.2 2.9GB/1.3GB - Samsung 980Starting Memory: 8GB DDR4 2666MHz RAMMax Memory: Up to 64GBRAID: 0,1 via LSI MegaRAIDPorts: 2 x LAN , 2 x COM USB: 8 x USB 2.0 Ports , 6 x USB 3.2 Gen 1 Ports , 2 x USB 3.2 Gen 2 Ports Low Profile Slots: 2 x PCIe x16 , 3 x PCIe x1 , 2 x PCI CD/DVD Optional Long Production through Q3 2025
Type: RackmountProcessor: Xeon E-2100 (LGA1151, 8th & 9th Gen ‘Coffee Lake’)Chipset: Intel C246 ChipsetDimensions of Enclosure: 18"D x 16.90"W x 3.50"HStarting Hard Drive: 250GB NVMe SSD M.2 2.9GB/1.3GB - Samsung 980Starting Memory: 8GB DDR4 3200MHz RAMMax Memory: Up to 128GBRAID: 0,1,5,10Ports: 2 x LAN , 4 x COM USB: 6 x USB 2.0 Ports , 2 x USB 3.2 Gen 1 Ports , 4 x USB 3.2 Gen 2 Ports Full Height Slots: Multiple configurations availableCD/DVD Optional
Long Production through Q3 2025
Type: RackmountProcessor: Xeon E-2100 (LGA1151, 8th & 9th Gen ‘Coffee Lake’)Chipset: Intel C246 ChipsetDimensions of Enclosure: 17"D x 19"W x 3.50"HStarting Hard Drive: 250GB NVMe SSD M.2 2.9GB/1.3GB - Samsung 980Starting Memory: 8GB DDR4 3200MHz RAMMax Memory: Up to 128GBRAID: 0,1,5,10Ports: 2 x LAN , 4 x COM USB: 6 x USB 2.0 Ports , 2 x USB 3.2 Gen 1 Ports , 4 x USB 3.2 Gen 2 Ports Full Height Slots: Multiple configurations availableCD/DVD Optional
Long Production through Q1 2025
Type: RackmountProcessor: Intel® Xeon® Scalable Processors 3rd GenChipset: Intel C621A ChipsetDimensions of Enclosure: 17.72"D x 17.24"W x 3.46"HStarting Hard Drive: 250GB NVMe SSD M.2 2.9GB/1.3GB - Samsung 980Starting Memory: 4x 8GB DDR4 2666MHz ECC Registered RAMMax Memory: Up to 128GBRAID: 0,1,5,10Ports: 2 x LAN USB: 4 x USB 3.2 Gen 1 Ports Full Height Slots: 1 x PCIe x16 , 1 x PCIe x8 CD/DVD Optional Long Production through Q1 2025
Type: RackmountProcessor: Intel® Xeon® Scalable Processors 3rd GenChipset: Intel C621A ChipsetFront Facing I/O Dimensions of Enclosure: 17.72"D x 17.24"W x 3.46"HStarting Hard Drive: 250GB NVMe SSD M.2 2.9GB/1.3GB - Samsung 980Starting Memory: 4x 8GB DDR4 2666MHz ECC Registered RAMMax Memory: Up to 128GBRAID: 0,1,5,10Ports: 2 x LAN USB: 4 x USB 3.2 Gen 1 Ports Full Height Slots: 1 x PCIe x16 , 1 x PCIe x8 CD/DVD Optional